Process Engineer, Heterogeneous Integration

Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do.

Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers.

This position is within the High Frequency Technology Center (HFTC) at our Headquarters in Santa Rosa, CA. At the center of beautiful Sonoma County, just an hour north of San Francisco, you will live close to vineyards, redwood forests, regional and state parks, and a vibrant culinary scene, while developing state-of-the-art semiconductor manufacturing technologies at our worldclass IC and Heterogeneous Integration fabs.

HFTC is part of Keysight Labs, the core R&D organization that enables Centers of Excellence and other business groups to provide RF, microwave, mmWave, 5G and 6G solutions to customers in various industries, including communications, aerospace & defense, automotive & energy, general electronics, manufacturing, and semiconductor industries. HFTC technologies include InP and GaAs-based HBTs, HEMTs, and diodes, as well as high-frequency System in Package (SiP) and PCA subsystem solutions.

We focus on process research and development, process integration, and New Product Introduction. You will lead the development of next-generation System in Package (SiP) modules that will be integrated with microwave and mmWave subsystems across Keysight, serving multiple industries.

Responsibilities may include:

• Develop and maintain wafer fabrication processes
• Develop and maintain package assembly processes
• Specify, select and qualify new equipment
• Contribute to process automation
• Review new designs for manufacturability and provide feedback to module designers
• Understand process flows, product design and performance requirements, and lead manufacturing teams to develop new products that meet performance targets
• Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams
• Meet accelerated project schedules; communicate and manage risks
• Develop and maintain high yields while adhering to project schedules

We are seeking an industry professional with proven expertise in one or more of the following areas:

• Design for manufacturing of electromechanical assemblies
• Statistical process control (SPC), design of experiments (DOE)
• Thermocompression / flip chip bonding
• Surface Mount Technology (SMT) processes
• Die singulation
• Semiconductor fabrication processes
• Heterogeneous integration, advanced packaging techniques
• New technology introduction
• New product introduction

This role requires strong leadership, drive, and ambition to realize a novel technology that differentiates Keysight in 6G markets. Excellent interpersonal and communication skills are important for successful cross-functional interactions.

BS or MS in Mechanical Engineering, Manufacturing Engineering, Materials Science, Physics, Chemistry, or relevant fields.

Professional experience in the following areas is desired:

• III-V compound semiconductors and/or silicon technologies
• Thermal, mechanical and electrical reliability
• Technical project management, project lifecycle

Santa Rosa, CA Pay Range: USD $132,330.00 - USD $220,550.00 Year

Careers Privacy Statement***Keysight is an Equal Opportunity Employer.***