Sr. Process Engineer, Dry Etch, Terafab

We are buildingTerafab, a vertically integrated semiconductor factoryatan unprecedented scale. The facility houses logic, memory, packaging, test, and lithography mask production under one roof,optimizedfor rapid iteration andmaximumcompute density per square foot.

Process engineering is whereTerafabtechnology gets built, atom by atom, and dry etch is where plasma meets precision. You will develop and own etch processes across three distinct chip families: edge-inference processors, space-hardened chips for orbital satellites, and high-bandwidth memory.You'lloptimizeselectivity, profile control, and critical dimension uniformity across complex material stacks; from high-k dielectrics to metal gates to through-silicon vias.

You should have deepexpertisein plasmaetch, butbe ready to work across core process domains such as lithography, metrology, and film deposition as integration evolves. This is a highly hands-on roleatone of the most ambitiousfabprograms in the world.

• Develop and qualify plasma etch processes for critical layers: gate, spacer, contact, and metal interconnect

• Develop atomic layer etch processes for steps requiring angstrom-level profile and selectivity control

• Optimize etch profiles, CD control, uniformity, and selectivity using a first-principles, physics-based approach to plasma chemistry and etch mechanism understanding

• Qualify etch tools from installation through production readiness, including chamber seasoning, plasma characterization, and process window qualification

• Analyze processes from a first-principles, physics-based approach to understand and manipulate mechanisms, not just recipes

• Lead root cause analysis, establish inline metrology and SPC control strategies, and drive systematic yield improvement

• Support 24/7 manufacturing operations through rotations, on-call availability, and rapid response to critical production issues

• Drive next-generation plasma etch chemistry and process development

• Degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related technical field, or equivalent experience

• 5+ years of hands-on dry etch process engineering experience in a semiconductor fab, especially advanced logic, memory, or foundry environment

• Deep experience with etch tool qualification, plasma etch process development, and process of record (POR) establishment at advanced nodes

• Proficiency with etch metrology tools, defect inspection, and etch profile characterization

• Strong Design of Experiments skills and statistical analysis capability

• Ability to work closely and proactively across lithography, etch, thin films, integration, and equipment engineering teams