Bold Thinking. World Changing. At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location - employees join together to improve the world.
Explore what's possible. Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning "science fiction" into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.
Step into the future. SkyWater's values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees - and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.
Are you bold thinking? Find your place on our team and help us change the world!
Position Summary
The Member of Technical Staff (MTS) of Advanced Packaging & Module Engineering is a strategic leader responsible for defining and executing the vision, scope, and long-term strategy for module engineering and advanced packaging across process and equipment. This role drives the development and industrialization of next-generation semiconductor packaging solutions from R&D through high-volume manufacturing (HVM), integrating technology innovation with operational excellence to deliver differentiated business outcomes. The MTS is accountable for end-to-end module performance, including process development, qualification, statistical process control (SPC), and capability optimization. This leader partners cross-functionally across engineering, operations, and external stakeholders to deliver scalable, reliable, and cost-effective solutions. This role reports directly to the SVP of Engineering and operates as a peer to other senior engineering leaders, with enterprise accountability for advanced packaging and module engineering strategy and execution.
Major Area of Accountability
- Technological Roadmap: Define and drive the advanced packaging technology roadmap in partnership with the CTO, aligning with business objectives and market trends. Translate strategy into execution through integrated process and equipment development, ensuring clear linkage to measurable business outcomes. Own the enterprise vision, scope, and direction for Module Engineering (process and equipment).
- Continuous Improvement & Accountability: Drive a culture of data-driven decision-making and continuous improvement through operational metrics, process discipline, and structured performance reviews. Act as a strategic technical partner to people leaders by identifying operational pain points, execution gaps, and performance opportunities, enabling leadership teams to drive accountability and improve process capability, execution rigor, and business outcomes.
- Process Development & Module Performance: Lead the development, optimization, qualification, and documentation of advanced packaging technologies (e.g., 2.5D/3D integration, hybrid bonding, wafer-level packaging). Own end-to-end module performance, including yield, cost, cycle time, and reliability, and integrate process and equipment strategies to enhance factory capability and efficiency.
- Cross-Functional Leadership & Execution: Lead as a cross-functional liaison for teams across operations, Advanced Technology Services, Platform Technology, quality, supply chain, and IT/automation to enable seamless technology transfer, resolve complex technical challenges, and accelerate time to market.
- Yield & Quality Improvement: Drive improvements in process capability (Cpk), yield, quality, cost, and cycle time through statistical process control (SPC), advanced analytics, and data-driven problem-solving methodologies. Establish scalable continuous improvement frameworks (e.g., tiered management, visual management, A3/8D, Kaizen) and provide technical leadership to enable operational teams and people leaders to drive sustainable performance improvements and execution rigor across the organization.
- External Partner & Customer Engagement: Serve as the primary technical interface for customers, research partners, and equipment/material suppliers to align technology roadmaps, support technology qualifications, and drive execution against business and operational objectives. Leverage industry trends, customer feedback, and competitive benchmarking to accelerate adoption of advanced manufacturing capabilities in process control, automation, and process development (e.g., APC, AI-enabled SPC), while enabling scalable and manufacturable solutions.
- Project & Program Management: Lead the execution of complex development and qualification programs from concept through HVM, ensuring alignment to technical and business objectives. Govern portfolio prioritization and phase-gate discipline, and implement KPI and OKR frameworks to track performance, drive accountability, and enable effective decision-making.
Required Qualifications
- Education: BS, M.S. or Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
- 12+ years of semiconductor technology development, advanced packaging, and/or process integration experience.
- Experience in Advanced Packaging preferred.
- Proven track record of driving advanced packaging technology and/or semiconductor wafer fab technology from R&D to HVM (high-volume manufacturing).
- Expert knowledge of semiconductor manufacturing processes (Litho, Etch, Deposition, CMP, etc.) and/or advanced packaging technologies and formats (FOWLP, FCBGA, SiP, RDL, 3DIC, HBM). Direct experience with FOWLP, TSV, bonding preferred.
- Expertise in wafer-level packaging, 2.5D/3D IC integration, advanced substrates, thermal/mechanical reliability, and/or heterogeneous integration.
- Demonstrated ability to engage with customers at executive and technical levels to shape joint technology roadmaps.
- Experience leading multi-disciplinary teams across the organization and complex technology programs.
- Understanding of existing and evolving advanced packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
- Wafer and package processing tools and metrology knowledge/experience.
- Working knowledge of materials characterization and analysis.
- Working knowledge of wafer bumping, solder sphere transfer / ball drop processing or packaging lines.
- Experience with data gathering (e.g. queries), processing, and statistical analysis and control.
- Experience in low volume/high product mix environments.
- Expert in DOE, SPC, and 6-sigma concepts and applications.
- Demonstrated experience deploying structured problem-solving (A3/8D, DMAIC) at scale and leading continuous improvement systems.
- Strategic thinker with ability to connect technology direction to business value.
- Strong program management, budget ownership, and operational excellence mindset.
- Excellent communication, collaboration, and executive presence.
- Clear problem-solving, data driven, and inventive solution oriented capabilities and can articulate thought processes.
- Proven ability to define and govern KPI/OKR frameworks that drive enterprise outcomes.
- Ability to build purpose-driven team culture; coach leaders; and develop succession/talent pipelines.
- Positive interpersonal skills; highly energetic and self-motivated; demonstrated ability to meet commitments and deliver results.
- Minimum of 5 years of people-leadership experience (managing managers and senior engineers) in semiconductor manufacturing.
- US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance.
The annual salary range for this role is $184,400 - $276,600. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.
SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.
Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.
SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Recruiting@SkyWatertechnology.com.
EOE, including disability/vets
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SkyWater Technology
life insurance, paid time off, paid holidays, 401(k)
Jun 29, 2026